Before removing the I/O board cable, follow these steps:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 39).
2. Remove the bottom cover (see Bottom cover on page 39).
3. Disconnect the battery cable from the system board (see Battery on page 41).
4. Remove the WWAN module (see WWAN module on page 43).
5. Remove the SSD (see Solid-state drive on page 45).
6. Remove the fan (see Fan on page 50).
7. Remove the system board (see System board on page 52).
Remove the I/O board cable:
1. Turn the system board upside down with the front toward you.
2. Release the ZIF connectors (1) the I/O board cable and nano SIM cable are connected to, and then
disconnect the I/O board cable (2) and nano SIM cable from the system board.
To replace the I/O board cable, reverse the removal procedures.
Heat sink
To remove the heat sink, use these procedures and illustrations.
Table 5-11
Heat sink description and part number
Description Spare part number
Heat sink (includes replacement thermal material) N96443-001
Before removing the heat sink, follow these steps:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 39).
2. Remove the bottom cover (see Bottom cover on page 39).
3. Disconnect the battery cable from the system board (see Battery on page 41).
4. Remove the WWAN module (see WWAN module on page 43).
56
Chapter 5 Removal and replacement procedures for authorized service provider parts
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