4–42 Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the heat sink is removed:
❏ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
❏ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
❏ Thermal pads are used on the Southbridge chip 5 and the heat sink section 6 that services it.
Replacement thermal material is included with all system board and heat sink spare part kits.
Reverse this procedure to install the heat sink.
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