HP Z200 User Manual

Component locations ............................................................................................... 67
Predisassembly procedures ....................................................................................... 69
Disassembly order ................................................................................................... 70
Removing the cable lock (optional) ............................................................................ 70
Access panel .......................................................................................................... 72
Removing the access panel ........................................................................ 72
Installing the access panel ......................................................................... 72
Replacing the card hold-down bracket ........................................................ 72
Bezel ..................................................................................................................... 74
Removing the front bezel ........................................................................... 74
Installing the front bezel ............................................................................ 74
Front bezel security .................................................................................. 75
Access panel sensor (optional) .................................................................................. 76
Removing the access panel sensor .............................................................. 76
Installing the access panel sensor ............................................................... 77
Access panel solenoid lock ....................................................................................... 78
Removing the access panel solenoid lock .................................................... 78
Installing the access panel solenoid lock ...................................................... 78
Removing and installing drives .................................................................................. 78
Predisassembly for drives .......................................................................... 79
Follow all general predisassembly procedures .............................. 79
Perform a data backup .............................................................. 79
Gather required tools ................................................................. 79
Verify drive position and information ........................................... 79
Remove bezel blanks ................................................................. 80
Locate system board drive connections ......................................... 80
Locating extra guide screws ........................................................ 81
Carefully handle hard disk drives ................................................ 82
Removing an optical drive ......................................................................... 83
Installing an optical drive .......................................................................... 85
Removing a hard disk or media card from the drive cage ............................. 87
Installing a hard drive or media card reader into the drive cage .................... 89
Removing a DX115 Dataport hard drive ..................................................... 90
Installing a DX115 Dataport hard drive ....................................................... 95
Removing and replacing the primary hard drive ......................................... 101
Cable management ............................................................................................... 106
Power connections ................................................................................. 107
Using the Small Form Factor Computer in a Tower Orientation ................................... 108
Front panel I/O device assembly ............................................................................ 109
Removing the front panel I/O device assembly .......................................... 109
Installing the front panel I/O device assembly ........................................... 111
Speaker ............................................................................................................... 113
Removing the speaker ............................................................................. 113
Installing the speaker .............................................................................. 113
viii ENWW

HP Z200 Specifications

General

Tcase	69.1 °C
Bus type	DMI
Stepping	D2
FSB Parity	No
Processor cache	8 MB
Processor cores	4
Processor model	E3-1240
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200
Processor socket	LGA 1155 (Socket H2)
Processor threads	8
Processor codename	Sandy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	3.7 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Maximum number of PCI Express lanes	20
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
Audio system	HD
Product type	Workstation
Motherboard chipset	Intel® C206
Memory slots	4x DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	- GB
HDD speed	7200 RPM
RAID levels	0, 1
HDD capacity	1000 GB
HDD interface	SATA
Optical drive type	DVD-RW
Card reader integrated	-
Graphics card	Quadro 2000
Power supply type	AC
External drive bays	3 x 5.25\
Internal drive bays	3 x 3.5\
Networking features	Gigabit Ethernet (10/100/1000)
Graphics card family	NVIDIA
Maximum graphics card memory	1.024 GB
Modem (RJ-11) ports	0
PS/2 ports quantity	2
USB 2.0 ports quantity	14
Chassis type	Minitower
Product color	Black
Country of origin	China
Number of 3.5\" bays	3
Bundled software	HP ProtectTools
Operating system installed	Windows 7 Professional
Operating temperature (T-T)	5 - 35 °C
Operating relative humidity (H-H)	20 - 85 %
Power supply	400 W
Power supply input voltage	100-240 V
Power supply input frequency	50 - 60 Hz
Certification	ENERGY STAR 5.0
Processor code	SR00K
Processor ARK ID	52273
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	455 mm
Width	178 mm
Height	447 mm
Weight	10400 g