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HP Z200 User Manual

HP Z200
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5. Disconnect the heatsink screws from the system board (1) as shown in the following figure.
Figure 5-80 Disconnecting the heatsink screws
6.
Before lifting the heatsink, gently twist the heatsink to break the thermal compound between the
CPU and the heatsink.
7.
Lift the CPU heatsink out of the chassis (2).
8.
Use alcohol and a soft cloth to clean the thermal interface residue from the CPU and the heatsink.
Let the alcohol on the CPU and CPU heatsink dry completely.
Installing the CPU heatsink
To install a heatsink:
1.
Prepare the computer for servicing by following the
Predisassembly procedures on page 69.
CAUTION: Failure to follow the predisassembly procedures can result in equipment damage or
data loss.
2.
Remove the access panel (see
Removing the access panel on page 72).
3.
Remove the airflow guide.
4.
Perform one of the following tasks:
If you are reusing the original heatsink, clean the old themal compound from the bottom of
the heatsink, then apply a new layer of thermal compound to the center of the CPU top
surface.
If you are using a new CPU heatsink, remove the thermal compound protective liner from the
bottom of the new heatsink. (New heatsinks already have thermal compound on the heatsink
surface.)
5.
Align the heatsink's four mounting screws with the mounting holes in the chassis.
6.
Carefully place the heatsink on the CPU.
ENWW
Removing and installing components
133

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HP Z200 Specifications

General IconGeneral
Tcase69.1 °C
Bus typeDMI
SteppingD2
FSB ParityNo
Processor cache8 MB
Processor cores4
Processor modelE3-1240
System bus rate5 GT/s
Processor seriesIntel Xeon E3-1200
Processor socketLGA 1155 (Socket H2)
Processor threads8
Processor codenameSandy Bridge
Processor frequency3.3 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency3.7 GHz
Processor operating modes64-bit
ECC supported by processorYes
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)33
Maximum number of PCI Express lanes20
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1066, 1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Maximum internal memory supported by processor32 GB
Audio systemHD
Product typeWorkstation
Motherboard chipsetIntel® C206
Memory slots4x DIMM
Internal memory8 GB
Memory channelsDual-channel
Memory clock speed1333 MHz
Maximum internal memory- GB
HDD speed7200 RPM
RAID levels0, 1
HDD capacity1000 GB
HDD interfaceSATA
Optical drive typeDVD-RW
Card reader integrated-
Graphics cardQuadro 2000
Power supply typeAC
External drive bays3 x 5.25\
Internal drive bays3 x 3.5\
Networking featuresGigabit Ethernet (10/100/1000)
Graphics card familyNVIDIA
Maximum graphics card memory1.024 GB
Modem (RJ-11) ports0
PS/2 ports quantity2
USB 2.0 ports quantity14
Chassis typeMinitower
Product colorBlack
Country of originChina
Number of 3.5\" bays3
Bundled softwareHP ProtectTools
Operating system installedWindows 7 Professional
Operating temperature (T-T)5 - 35 °C
Operating relative humidity (H-H)20 - 85 %
Power supply400 W
Power supply input voltage100-240 V
Power supply input frequency50 - 60 Hz
CertificationENERGY STAR 5.0
Processor codeSR00K
Processor ARK ID52273
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth455 mm
Width178 mm
Height447 mm
Weight10400 g

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