b. Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink
assembly and the system board components, it may be necessary to move the heat sink assembly
from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and
the system board components each time the heat sink assembly is removed. Replacement thermal material is
included with the heat sink assembly, processor, and system board spare part kits.
●
On models with discrete graphics memory, thermal pads are used on the processor (1) and the graphics
board (3) and the heat sink sections (2) and (4), respectively, that service them
54 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts
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