Huawei ME906s LTE M.2 - Page 77

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Appendix B Acronyms and Abbreviations
Issue 05 (2019-03-25)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
77
Acronym or Abbreviation
Expansion
GSM
Global System for Mobile communication
HBM
Human Body Model
HSIC
High Speed Inter-Chip Interface
HSDPA
High-Speed Downlink Packet Access
HSPA+
Enhanced High Speed Packet Access
HSUPA
High Speed Up-link Packet Access
IPC
Inter Processor Communications
ISO
International Standards Organization
I2S
I2C Sound
LCD
Liquid Crystal Display
LCP
Liquid Crystal Polyester
LDO
Low-Dropout
LED
Light-Emitting Diode
LTE
Long Term Evolution
MCP
Multi-chip Package
MIPI
Mobile Industry Processor Interface
NGFF
Next Generation Form Factor
NTC
Negative Temperature Coefficient
PA
Power Amplifier
PBCCH
Packet Broadcast Control Channel
PCB
Printed Circuit Board
PDU
Protocol Data Unit
PMU
Power Management Unit
RF
Radio Frequency
RoHS
Restriction of the Use of Certain Hazardous
Substances
RSE
Radiated Spurious Emission
RTC
Real-time Clock
SIMO
Single Input Multiple Output
TTL
Transistor-transistor Logic
TVS
Transient Voltage Suppressor