HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Mechanical Specifications
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
6.6 Label
The label is made from deformation-resistant, fade-resistant, and
high-temperature-resistant material and is able to endure the high temperature of
260°C .
Figure 6-2 ME909u-521 label
The picture mentioned above is only for reference.
6.7 Customer PCB Design
6.7.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.
6.7.2 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
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