HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Mechanical Specifications
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
6.10 Specification of Rework
6.10.1 Process of Rework
6.10.2 Preparations of Rework
Remove barrier or devices that can’t stand high temperature before rework.
If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .
6.10.3 Removing of the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.
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