Huawei ME909u-521 - Assembly Processes; General Description of Assembly Processes; Stencil Design

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
77
6.9 Assembly Processes
6.9.1 General Description of Assembly Processes
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Tray modules are required at SMT lines, because LGA modules are placed on
ESD pallets.
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Reflow ovens with at least seven temperature zones are recommended.
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Use reflow ovens or rework stations for soldering, because LGA modules have
large solder pads and cannot be soldered manually.
6.9.2 Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For
the stencil design. See the following figure:
Figure 6-7 Recommended stencil design of LGA module (Unit: mm)
The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.