Huawei ME909u-521 - Reflow Profile

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
78
6.9.3 Reflow Profile
For the soldering temperature of the LGA module, see the following figure.
Figure 6-8 Reflow profile
240
300
180
217
165
120
60
0
s
°C
60s~100s
45s~80s
235°C<Tmax<245°C
Table 6-2 Reflow parameters
Temperature Zone
Time
Key Parameter
Preheat zone
(40°C–165°C)
-
Heating rate: 0.5°C/s–2°C/s
Soak zone
(165°C–217°C)
(t1–t2): 60s–100s
-
Reflow zone (> 217°C)
(t3–t4): 45s–80s
Peak reflow temperature:
235°C –245°C
Cooling zone
Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s