IBM System x3100 M4 User Manual

3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat
sink.
Note: Make sure that all of the thermal grease is removed.
4. Use a clean area of the cleaning pad to wipe the thermal grease from the
microprocessor; then, dispose of the cleaning pad after all of the thermal grease
is removed.
Microprocessor
0.02 mL of thermal
grease
5. Use the thermal-grease syringe to place 9 uniformly spaced dots of 0.02 mL
each on the top of the microprocessor. The outermost dots must be within
approximately 5 mm of the edge of the microprocessor, this is to ensure uniform
distribution of the grease.
Note: If the grease is properly applied, approximately half of the grease will
remain in the syringe.
6. Install the heat sink onto the microprocessor as described in “Installing a
microprocessor and heat sink” on page 44.
Installing the power supply
To install a non-hot-swap power supply, complete the following steps:
1. Remove the air duct.
2. Remove the heat sink (see “Installing a microprocessor and heat sink” on page
44).
3. Position the power supply in the chassis so that the screw holes in the power
supply are aligned with the corresponding holes in the rear of the chassis.
Chapter 2. Installing optional devices 47

IBM System x3100 M4 Specifications

General

Memory	Up to 32 GB DDR3 ECC UDIMM
Memory Slots	4 DIMM slots
Form Factor	Tower
Chipset	Intel C202
Processor Sockets	1
Processor	Intel Xeon E3-1200 v2 series, Intel Pentium series, Intel Celeron series
Storage	Up to 4x 3.5-inch
Power Supply	350W
Hard Drive Bays	4 x 3.5"
RAID Support	RAID 0, 1, 10
Network Interface	Gigabit Ethernet
Expansion Slots	1 x PCIe 3.0 x16, 1 x PCIe 2.0 x4
Operating System Support	Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server