20 Intel
®
440Bx Scalable Performance Board Development Kit Manual
Theory of Operation
3.2 System Operation
The evaluation board is a full-featured system board and processor assembly. The processor
assembly includes an 850 MHz Pentium
®
III processor with 256 Kbytes of integrated L2 cache and
the Intel 82443BX Host Bridge/Controller. The evaluation board contains the Intel 82371EB PCI-
to-ISA/IDE Xcelerator (PIIX4E) and other system and I/O peripherals.
The evaluation board and processor assembly support other PGA370 socket processors. The
customer may remove the Pentium
III processor from the processor socket and replace it with
another supported processor. The evaluation board automatically detects which processor is
installed in the socket.
Warning: The processor assembly is attached to the baseboard at the factory. Do not remove the processor
assembly from the baseboard. Intel will not support the processor assembly or the baseboard if any
portion of the assembly is removed by the customer.
3.2.1 Supported Processors
An 850 MHz Pentium III processor is supplied in your kit. You may replace the supplied processor
with one of the following:
• 600 and 700 MHz Pentium
®
III processor. These processors have a 256-Kbyte integrated L2
cache, and support a 100-MHz processor system bus.
• 300A, 366 and 433, 566, 733 and 850 MHz Celeron™ processor. These processors have a
128-Kbyte integrated L2 cache, and support a 66 MHz processor system bus (except for the
850 MHz Celeron processor, which has a 100 MHz processor system bus).
• Future PGA370-socketed Intel processors (.18µ and .25µ technologies) that support a 66 or
100 MHz processor system bus
3.2.1.1 Intel
®
Pentium
®
III Processor
The Pentium III processor for applied computing is offered at 600, 700 and 850 MHz with a
processor system bus speed of 100 MHz. Refer to the processor datasheet for processor core
voltage data (see “Related Documents” on page 10). The processor has an on-die second level
cache bus that allows a high-performance 64-bit wide cache subsystem to be integrated on the
same die as the processor. The processor can cache up to 4 Gbytes of memory using 128 Kbytes of
L2 cache, 16 Kbytes of L1 data cache and 16 Kbytes of L1 code cache. The on-die first and second
level cache operate at the same frequency and voltage as the processor core to improve
performance and reduce total system power consumption.
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