Intel DH55PJ User Manual

Regulatory Compliance and Battery Disposal Information
79
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology
за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
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Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.4 EMC Regulations
The Intel Desktop Board DH55PJ complies with the EMC regulations stated in Table 44
when correctly installed in a compatible host system.
Table 44. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022 Limits and methods of measurement of Radio Interference Characteristics of
Information Technology Equipment. (European Union)
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Intel DH55PJ Specifications

General

Form Factor	Micro ATX
Socket	LGA 1156
Memory Type	DDR3
Maximum Memory	8 GB
Memory Slots	2
PCI Express x16	1
PCI Express x1	2
PCI Slots	1
Chipset	Intel H55 Express
USB Ports	12
Video Outputs	VGA
SATA Ports	6

Summary

Product Description and Features

Overview

Provides a general overview of the Intel Desktop Board DH55PJ.

Feature Summary

Summarizes the major features of the motherboard.

Board Layout

Illustrates the physical layout of major components on the motherboard.

Block Diagram

Depicts the major functional areas and interconnections of the motherboard.

System Components and Configuration

Processor

Describes supported processors and their specifications.

Chipset and Memory

Details the H55 chipset and system memory features.

Memory Configurations

Explains dual channel (interleaved) and single channel (asymmetric) memory modes.

Legacy Considerations

Details differences from other Intel Desktop Board products and legacy features.

Online Support

Provides web links for product information, support, and drivers.

Graphics, Audio, Networking, and Storage

Graphics Subsystem

Covers integrated graphics support, including VGA and DVI-D outputs.

Integrated Graphics

Details integrated graphics support via Intel Flexible Display Interface.

PCI Express x16 Graphics

Details support for discrete add-in graphics cards via PCIe x16.

USB and SATA Interfaces

Describes USB ports and internal SATA connectors.

LAN Subsystem

Details the Gigabit Ethernet controller and RJ-45 connector.

Audio Subsystem

Covers audio features, codec, and capabilities.

System Management, Power, and Hardware

Hardware Management

Lists hardware management features like monitoring and fan control.

Thermal Monitoring

Shows locations of thermal sensors and fan headers.

Power Management

Explains power management implementation levels.

ACPI and Power States

Explains ACPI and supported system power states.

Wake-up Features

Details devices and events that can wake the computer from sleep states.

Connectors, Jumpers, and Electrical

Board Connectors and Headers

Introduces board connectors and headers, including back panel and component-side.

Connector Signal Details

Provides pinout and signal names for various port headers.

Front Panel Interfaces

Covers front panel header, controls, LEDs, and USB headers.

Jumper Block

Explains the location and function of the BIOS setup jumper block.

Electrical and Power Supply Considerations

Discusses power supply requirements, ATX compliance, and current ratings.

BIOS Features and Updates

BIOS Introduction and Features

Introduces the Intel BIOS, its storage, POST messages, and menu structure.

BIOS Updates and Recovery

Describes utilities for updating the BIOS and procedures for BIOS recovery.

Boot Options

Covers booting from various devices like hard drive, optical, network, and removable media.

BIOS Security Features

Explains supervisor and user passwords for BIOS and boot security.

Troubleshooting and Diagnostics

BIOS Error Codes

Lists and explains BIOS beep codes, LED blink codes, error messages, and POST codes.

Regulatory Compliance and Safety

Regulatory Compliance

Provides information on safety, EMC, and product certifications.

Safety and Environmental Information

Covers safety standards, environmental specs, and energy compliance.

Battery Disposal Information

Provides cautions and guidelines for battery replacement and disposal.