Intel DH55PJ - Product Description and Features; Overview; Feature Summary

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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor
• Intel
®
Core™ i7, Intel
®
Core™ i5, Intel
®
Core™ i3, and Intel
®
Pentium
®
processors in an LGA1156 socket:
― Integrated graphics processing (processors with Intel
®
Graphics
Technology)
― External graphics interface controller
― Integrated memory controller
Chipset
Intel
®
H55 Express Chipset consisting of the Intel
®
H55 Platform Controller
Hub (PCH)
Memory
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 8 GB of system memory with two DIMMs using 2 Gb memory
technology
• Support for non-ECC memory
Graphics
• Integrated graphics support for processors with Intel Graphics Technology:
― VGA
― DVI-D
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio Intel
®
High Definition Audio via the Realtek* ALC888S audio codec
Peripheral
Interfaces
• Twelve USB 2.0 ports:
― Six ports are implemented with stacked back panel connectors
― Six front panel ports are implemented with three dual-port internal headers
• Four internal Serial ATA (SATA) 3.0 Gb/s ports
• One serial port header
• One parallel port header
• One back panel PS/2 connector
BIOS
• Intel
®
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued