Kirisun DM588 - Page 56

DM588 Service Manual
SN
Material NO
Material Name
Specifications
QTY
Component NO
182
2RS1-10-304J
R chip resistor
1005, 300K±5%
1
R181
183
5XT1-MC146-32R7
6K
E SMD ceramic
resonator
32.768KHZ, MC-146, 12.5PF, 20PPM,
lead free
1 X301
184 1IS1-LTJIAMI Encryption chip LTJIAMI, for model DP585 1 IC18
185 1IP1-0DM588-R01 Burning chip
FLASH IC, for burning software of model
DP585
1 IC20
186
9FSO-DM588V010
002
Software of model
DM588
DM588, V1.0.0.2 1
187
1IM1-H8ACS0PG0
ABR-A
H8ACS0PG0ABR IC
SU HYnix, MCP, 1Gb (128Mb x8) NAND
Flash+512Mb (32Mb x16) mobile
1 IC20
188
2RS1-10-202J
R chip resistor
1005, 2K±5%
1
R225
189
2RS1-10-823J
R chip resistor
1005, 82K±5%
1
R304
190
5OT1-26R0-HHL-0
303
Temperature
compensated crystal
oscillator
26MHz±2ppm, -30℃ to +85℃, ,2.8V,
3.2*2.5, Xiamen Yixin, lead free
1 Y3
191
2CC1-16-C0G500-1
01J
R multi-layer chip
capacitor
1608, 100P±5%, 50V, C0G 7 C306,C328,C329,C482,C486,C489,C496
192
2CC1-16-X7R500-1
04K
R multi-layer chip
capacitor
1608, 100nF±10%, 50V, X7R 5 C326,C480,C483,C488,C500
193 1DR1-ESD9B5 TVS diode ESD9B5.0ST5G, 5V, SOD923, lead free 10 D23,D24,D25,D26,D27,D28,D32,D33,D34,D35
194 1IS1-ADS1015 AD-to-IC converter
ADS105IRUGT, 10-Pin, QFN
encapsulation, TI, lead free
1 IC2
195
1ID1-TS3A24159D
GSR
Single-pole
double-throw analog
electronic switch
TS3A24159DGSR, lead free 1 IC4
196 1IS1-DAC104S085 DA converter chip
For model DP585, DAC104S085,
VSSOP encapsulation
1 IC9
197
1DR1-TPD4S012D
RY
TVS diode
TPD4S012DRY, 4-CHANNEL ESD
SOLUTION FOR USB-HS/USB
1 IC21
53