Kirisun DM588 - Page 61

DM588 Service Manual
Table 2 Material List of Main Board DM588-02 (400MHz-470MHz)
SN
Material NO
Material Name
Specifications
QTY
Component NO
1 6SS1-4291-HMC2
SMD nesting for main
board DM588-02 (with
GPS module)
LT1901 scheme, 400~470 MHz 1
2
2CC1-20-X5R160-1
06KD
Multi-layer chip
capacitor
2012, 10uF±10%, 16V, TAIYO,
EMK212ABJ106KD-T, 0.85±0.1mm high
44
C1,C2,C28,C29,C30,C31,C32,C35,C307,C403,C4
04,C448,C527,C530,C533,C535,
C47,C85,C88,C149,C50,C370,C371,
C373,C374,C376,C377,C381,C382,C399,C55,C6
0,C418,C444,C445,C312,C315,C236,C237,C338,
C348,C44,C46,C421
3
2CC1-10-X5R500-1
04K
Multi-layer chip
capacitor
1005, 100nF±10%, 50V, X5R 41
C3,C8,C12,C18,C19,C22,C33,C34,C36,C37,C38,
C41,C45,C52,C308,C528,C529,C531,C532,C534,
C536,C313,C314,C316,C317,C318,C319,C320,C
321,C322,C323,C102,C87,C90,C91,C92,C95,C96
,C103,C53,C54
4
2CC1-10-X7R250-2
23K
R multi-layer chip
capacitor
1005, 22nF±10%, 25V, X7R 5 C4,C9,C13,C24,C460
5
2CC1-32-X5R500-1
06K
Multi-layer chip
capacitor
1206, 10UF, 50V, ±10%, X5R,
GRM31CR61H106KA12#
6 C5,C14,C15,C16,C17,C23
6
2CC1-10-C0G500-1
51J
R multi-layer chip
capacitor
1005, 150P±5%, 50V, C0G 31
C6,C10,C393,C462,C81,C82,C83,C84,C125,C127
,C140,C142,C153,C172,C176,C177,C181,C182,C
215,C219,C221,C384,C476,C477,C250,C251,C25
2,C255,C61,C565,C580,C305,C388,C397,C400,C
405,C406,C434,C446,C447,C513,C514,C515,C51
6,C517,C522,C548,C559
7
2CC1-10-X7R500-1
02K
R multi-layer chip
capacitor
1005, 1000P±10%, 50V, X7R 67
C7,C11,C20,C25,C26,C398,C463,C105,C108,C15
7,C214,C231,C235,C239,C280,C282,C295,C297,
C304,C330,C337,C339,C551,C49,C369,C372,C3
58