Kirisun DM588 - Page 74

DM588 Service Manual
SN
Material NO
Material Name
Specifications
QTY
Component NO
200 7MDC-4207-01A-W
VCO shield cover (for
model DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 31.05*13.3*3; lead free,
Chuanghong brand
3 P1,P2,P3
201 7MDC-4207-03A-W
Automatic power
control (APC) shield
cover (for DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 21.3*11.45*2.2; lead free,
Chuanghong brand
1 Y1
202 7MDC-4072-08A-W STP-V shield cover 2
Material: Copper-Nickel-Zinc alloy,
T=0.2, 14.3*11.65*1.9, original color,
lead free, Junyu brand
2 X1,X2
203
2CC1-16-C0G500-7
R0C
Multi-layer chip
capacitor
1608, 7P±0.25P,50V,C0G 1 C599
204
2LH1-R501R5-R05-
05
SMD air core inductor
Wire diameter φ0.50, inner diameter
φ1.5, 5-wind, forward winding, high pin
1 L69
205
2RT1-NCP18WF10
4J03RB
SMD thermistor 1608, NCP18WF104J03RB 1 R333
206 6PM7-4291-HMB Main board
DM588_MAIN_171113,
138X85.8X1.6MM, 6-layer, FR-4, lead
free
1
207 1IP1-0DM588-R01 Burning chip
FLASH IC, for burning software of
DM588
1
208
9FSO-DM588V0100
02
Software DM588_V1.0.0.2 1
209
1IM1-H8ACS0PG0
ABR-A
H8ACS0PG0ABR IC
SU HYnix, MCP, 1Gb (128Mb x8)NAND
Flash+512Mb(32Mb x16) mobile
1 IC20
210
2RS1-10-223J
R chip resistor
1005, 22K±5%
1
R19
211
2CC1-10-X7R500-2
22K
R multi-layer chip
capacitor
1005, 2200P±10%, 50V, X7R 1 C223
212
2CC1-32-C0G102-5
R0J
R multi-layer chip
capacitor
3216, 5P±5%, 1000V, C0G 1 C194
71