Kirisun DM588 - Page 76

DM588 Service Manual
SN
Material NO
Material Name
Specifications
QTY
Component NO
free
228 3CE3-CZ35-F 3.5mm earphone jack
PJ-3511-0, Chenfengda brand, 4-pin,
with switch, lead free
1 J600
229 1IS3-DS18B20 IC
Temperature sensor for plug-ins,
3.0~5.5V supply, -55~125°C, TO-92
1 IC25
230 3CL3-PH-20002 R bar connector
Socket, PH type, spacing 2MM,
2-core/WCPW20-02
1 J2
Table 3 Material List of Main Board DM588-08 (400MHz-480MHz)
SN
Material NO
Material Name
Specifications
QTY
Component NO
1 6BLS-MS621FE
Button cell (for models
DP980 and DP586)
MS621FE (Manganese and Silicon),
Lithium, 3V, 5.5mA, chargeable, lead
free
1 BT2
2 1IS3-DS18B20 IC
DALLAS
SEMICONDUCTOR,DS18B20,TO-92,-5
5~125
℃
1 IC25
3 3CE3-CZ35-F 3.5mm earphone jack
PJ-3511-0, Chenfengda brand, 4-pin,
with switch, lead free
1 J600
4 61SM000027
SMD nesting for main
board DM588-08 (with
GPS module)
400-480MHz,25W,with GPS 1
5
2CC1-20-X7R500-2
26M
Multi-layer chip
capacitor
,22,uF,±20%,10V,2012,X7R 43
C1,C2,C28,C29,C30,C31,C32,C35,C47,C50,C55,
C60,C85,C88,C149,C236,C237,C307,C312,C315,
C338,C348,C370,C371,C373,C374,C376,C377,C
381,C382,C399,C403,C404,C418,C444,C445,C44
8,C527,C530,C533,C44,C46,C421
6
2CC1-10-X5R500-1
04K
Multi-layer chip
capacitor
MURATA,GRM155R61H104K,100,nF,±
10%,50V,0402,X5R
40
C3,C8,C12,C18,C19,C22,C33,C34,C36,C37,C38,
C41,C45,C52,C53,C54,C87,C90,C91,C92,C95,C9
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