• Do not use any metal tools (such as jigs or clamps) to handle the memory modules, because the rigid
metals may damage the memory modules.
• Do not insert memory modules while holding packages or passive components, which can cause package
cracks or detachment of passive components by the high insertion force.
• Remove or install DIMMs for one processor at a time.
• Do not mix RDIMMs and LR-DIMMs in the same compute node.
• DIMMs are static-sensitive devices. The package must be grounded before it is opened.
Watch the procedure
A video of this procedure is available at YouTube:
https://www.youtube.com/playlist?list=PLYV5R7hVcs-
DtV8A4UWy7d3AoFKjCvas3
.
Step 1. Remove the air baffle (see
“Remove the air baffle” on page 33 for instructions).
Step 2. Locate the DIMM connectors (see
“System-board connectors” on page 19 for instructions).
Determine which DIMM connector you want to install the DIMM.
Step 3. Touch the static-protective package that contains the DIMM to any unpainted metal surface on the
Flex System chassis or any unpainted metal surface on any other grounded rack component in the
rack in which you are installing the DIMM for at least 2 seconds; then, remove the DIMM from its
package.
Step 4. Make sure that both retaining clips on the DIMM connector are in the open position.
Figure 14. Opening DIMM latch
Notes:
• If necessary due to space constraints, you can use a pointed tool to open the retaining clips.
Place the tip of the tool in the recess on the top of the retaining clip; then, carefully rotate the
retaining clip away from the DIMM connector.
38
ThinkSystem SN850 Compute Node Setup Guide
To Next Page
Loading...
