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HDD size | - \ |
---|---|
RAID support | Yes |
HDD interface | - |
Optical drive type | No |
Total storage capacity | - GB |
Maximum storage capacity | - TB |
Tcase | 86 °C |
Stepping | H0 |
Scalability | S4S |
Processor code | SR3B5 |
Processor cache | 27.5 MB |
Processor cores | 20 |
Processor model | 6138 |
System bus rate | - GT/s |
Processor socket | LGA 3647 (Socket P) |
Processor threads | 40 |
Processor codename | Skylake |
Processor frequency | 2 GHz |
Processor cache type | L3 |
Processor lithography | 14 nm |
Processor manufacturer | Intel |
Processor package size | 76.0 x 56.5 mm |
Processor boost frequency | 3.7 GHz |
Processor operating modes | 64-bit |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Thermal Design Power (TDP) | 125 W |
Number of processors installed | 1 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |
Memory channels supported by processor | Hexa |
Memory clock speeds supported by processor | 2666 MHz |
Maximum internal memory supported by processor | 768 GB |
Memory slots | 24 |
Internal memory | 32 GB |
USB 2.0 ports quantity | 0 |
Storage temperature (T-T) | -40 - 60 °C |
Operating temperature (T-T) | 10 - 35 °C |
Storage relative humidity (H-H) | 8 - 90 % |
Operating relative humidity (H-H) | 8 - 80 % |
PCI Express slots version | 3.0 |
Processor ARK ID | 120476 |
Intel TSX-NI version | 1.00 |
Depth | 493 mm |
---|---|
Width | 215 mm |
Height | 51 mm |
Weight | 7100 g |
Verifies conditions to identify potentially unsafe situations before server operation.
Details the features and technical specifications of the compute node.
Instructions for starting and stopping the compute node.
Identifies buttons, connectors, and LEDs on the compute node control panel.
Details system board components, connectors, switches, and LEDs.
Lists components available for the compute node and their replacement types.
Covers safety, handling, and component compatibility before installation.
Procedures for replacing the compute node, DIMMs, processors, and system board.
Instructions for replacing drives, backplanes, and storage cage.
Instructions for removing and installing DIMMs.
Procedures for replacing processors and heat sinks.
Instructions for removing and replacing the system-board assembly.
Procedures for removing and installing I/O expansion adapters.
Instructions for replacing M.2 drives and backplanes.
Procedures for removing and installing RAID adapters.
Procedures for replacing the CMOS battery.
Steps to remove and install the front bezel.
Steps for removing and installing the compute node cover.
Information on event logs and light path diagnostics for error identification.
General steps and symptom-based guidance for resolving issues.
Troubleshooting steps for common hardware and connectivity issues.
Addresses issues like POST display, unresponsiveness, and unusual smells.
Steps to take before contacting support and information to gather.
Methods for collecting system service data for analysis.
Ways to contact Lenovo for hardware service and technical support.
Lists trademarks and provides key information on product performance and warranties.
Information on environmental limits and regulatory compliance.