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Tcase | 89 °C |
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Bus type | UPI |
Stepping | H0 |
Scalability | S8S |
Processor code | SR37A |
Processor cache | 38.5 MB |
Processor cores | 28 |
Processor model | 8176 |
System bus rate | - GT/s |
Processor socket | LGA 3647 (Socket P) |
Processor threads | 56 |
Processor codename | Skylake |
Execute Disable Bit | Yes |
Processor frequency | 2.1 GHz |
Processor cache type | L3 |
Processor lithography | 14 nm |
Processor manufacturer | Intel |
Processor package size | 76.0 x 56.5 mm |
Processor boost frequency | 3.8 GHz |
Processor operating modes | 64-bit |
Embedded options available | No |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Thermal Design Power (TDP) | 165 W |
Number of processors installed | 4 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Maximum internal memory supported by processor | 768 GB |
Memory slots | 48x DIMM |
Internal memory | 128 GB |
Maximum internal memory | 6000 GB |
Memory layout (slots x size) | 4 x 32 GB |
Power supply | 1600 W |
Number of redundant power supplies installed | 2 |
HDD size | - \ |
RAID levels | 0, 1, 5, 6, 10, 50, 60 |
Supported HDD sizes | 2.5 \ |
Total storage capacity | 0 GB |
Maximum storage capacity | - TB |
Number of HDDs installed | - |
Supported RAID controllers | 930-8i |
Supported storage drive interfaces | SAS, Serial ATA III, M.2 |
USB 2.0 ports quantity | 0 |
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 3 |
PCI Express slots version | 3.0 |
PCI Express x8 (Gen 3.x) slots | 7 |
On-board graphics card model | Matrox G200 |
Chassis type | Rack (2U) |
Performance management | XClarity Advanced |
Trusted Platform Module (TPM) version | 1.2 |
Operating altitude | 0 - 3048 m |
Storage temperature (T-T) | -10 - 60 °C |
Operating temperature (T-T) | 5 - 45 °C |
Operating relative humidity (H-H) | 8 - 90 % |
Sustainability certificates | ENERGY STAR |
Processor ARK ID | 120508 |
Intel TSX-NI version | 1.00 |
Depth | 763.7 mm |
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Width | 482 mm |
Height | 86.5 mm |
Checklist to identify potentially unsafe conditions with the server.
Summary of server features and specifications, including dimensions, processor, memory, and expansion slots.
Options and procedures for updating server firmware using various Lenovo tools.
Precautions and best practices before installing server components.
Guidelines to prevent damage to components from electrostatic discharge.
Procedures for installing and removing 2.5-inch hot-swap drives and backplanes.
Procedures for removing and installing the CR2032 CMOS battery.
Procedures for removing and installing the server fan cage assembly.
Procedures for installing and removing M.2 drives and backplanes.
Procedures for removing and installing memory modules (DIMMs).
Procedures for replacing the operator panel tray assembly and front panel.
Procedures for replacing PCIe riser-card assemblies and adapters.
Procedures for installing and removing hot-swap power supply units.
Procedures for replacing processors, heat sinks, and PHMs.
Procedures for removing and installing the server system board.
Using LEDs on server components to trace and identify error sources.
Guides to resolve problems based on identifiable symptoms and actions.