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Lenovo ThinkSystem SR850 User Manual

Lenovo ThinkSystem SR850
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ThinkSystem SR850
Maintenance Manual
Machine Type: 7X18 and 7X19

Table of Contents

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Lenovo ThinkSystem SR850 Specifications

General IconGeneral
Tcase89 °C
Bus typeUPI
SteppingH0
ScalabilityS8S
Processor codeSR37A
Processor cache38.5 MB
Processor cores28
Processor model8176
System bus rate- GT/s
Processor socketLGA 3647 (Socket P)
Processor threads56
Processor codenameSkylake
Execute Disable BitYes
Processor frequency2.1 GHz
Processor cache typeL3
Processor lithography14 nm
Processor manufacturerIntel
Processor package size76.0 x 56.5 mm
Processor boost frequency3.8 GHz
Processor operating modes64-bit
Embedded options availableNo
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Thermal Design Power (TDP)165 W
Number of processors installed4
Maximum number of PCI Express lanes48
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Maximum internal memory supported by processor768 GB
Memory slots48x DIMM
Internal memory128 GB
Maximum internal memory6000 GB
Memory layout (slots x size)4 x 32 GB
Power supply1600 W
Number of redundant power supplies installed2
HDD size- \
RAID levels0, 1, 5, 6, 10, 50, 60
Supported HDD sizes2.5 \
Total storage capacity0 GB
Maximum storage capacity- TB
Number of HDDs installed-
Supported RAID controllers930-8i
Supported storage drive interfacesSAS, Serial ATA III, M.2
USB 2.0 ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
PCI Express slots version3.0
PCI Express x8 (Gen 3.x) slots7
On-board graphics card modelMatrox G200
Chassis typeRack (2U)
Performance managementXClarity Advanced
Trusted Platform Module (TPM) version1.2
Operating altitude0 - 3048 m
Storage temperature (T-T)-10 - 60 °C
Operating temperature (T-T)5 - 45 °C
Operating relative humidity (H-H)8 - 90 %
Sustainability certificatesENERGY STAR
Processor ARK ID120508
Intel TSX-NI version1.00
Weight and Dimensions IconWeight and Dimensions
Depth763.7 mm
Width482 mm
Height86.5 mm

Summary

Safety

Safety Inspection Checklist

Checklist to identify potentially unsafe conditions with the server.

Chapter 1. Introduction

Specifications

Summary of server features and specifications, including dimensions, processor, memory, and expansion slots.

Firmware Updates

Options and procedures for updating server firmware using various Lenovo tools.

Chapter 3. Hardware Replacement Procedures

Installation Guidelines

Precautions and best practices before installing server components.

Static-Sensitive Devices Handling

Guidelines to prevent damage to components from electrostatic discharge.

Drive and Drive Backplane Replacement

Procedures for installing and removing 2.5-inch hot-swap drives and backplanes.

CMOS Battery Replacement

Procedures for removing and installing the CR2032 CMOS battery.

Fan and Fan Cage Replacement

Procedures for removing and installing the server fan cage assembly.

M.2 Drive and Backplane Replacement

Procedures for installing and removing M.2 drives and backplanes.

Memory Module Replacement

Procedures for removing and installing memory modules (DIMMs).

Operator Panel Tray Assembly and Front Operator Panel Replacement

Procedures for replacing the operator panel tray assembly and front panel.

PCIe Riser-Card Assembly and Adapter Replacement

Procedures for replacing PCIe riser-card assemblies and adapters.

Power Supply Unit Replacement

Procedures for installing and removing hot-swap power supply units.

Processor and Heat Sink Replacement

Procedures for replacing processors, heat sinks, and PHMs.

System Board Replacement

Procedures for removing and installing the server system board.

Chapter 4. Problem determination

Light Path Diagnostics

Using LEDs on server components to trace and identify error sources.

Troubleshooting by Symptom

Guides to resolve problems based on identifiable symptoms and actions.

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