March PX-500 User Manual

Plasma Asher: March PX-500
User guide
(May-30, 2017)
This is a highly versatile plasma etch tool that can etch using a
direct plasma configuration (Oxygen plasma cleaner), a
downstream plasma (Remote plasma), and a directional
plasma (Reactive Ion Etch). We supply Oxygen (gas 1) and
Argon (gas 2) for use. Power can set up to 600 W, and
working pressure is controlled by gas flow. There are totally 9
programs for automatic process and can be modified by users.

March PX-500 Specifications

General

Brand	March
Model	PX-500
Category	Medical Equipment
Language	English

Summary

Shelf Configuration

For RIE plasma (Directional)

Describes RIE plasma shelf setup, pressure, and usage.

For Direct plasma

Explains Direct plasma shelf setup, pressure, and characteristics.

For downstream plasma

Details downstream plasma shelf setup, pressure, and usage.

Tool Operation

LOAD THE SUBSTRATE

Instructions for loading the sample into the chamber.

PROGRAMMING

Details on setting process parameters like pressure and time.

RUNNING THE PROCESS

Steps to start and monitor the plasma process.

RETREVING THE SUBSTRATE

Procedure for removing the sample after the process.

Appendix A

Chamber Pressure vs Gas Flow Rate

Chart showing relation between chamber pressure and gas flow.

Actual Flow Rate vs Flow Setting

Chart calibrating flow setting to actual flow rate.

Appendix B

Ashing Rates for Photomask SC1827 Resist

Table detailing ashing rates for specific resist under different conditions.

Appendix C

Process Controller Module

Overview of the process controller's functions and interface.

RF Power Generator