March PX-500 - Appendix B; Ashing Rates for Photomask SC1827 Resist

Appendix B
RIE1
1400
Direct plasma 250
RIE2 1200
Downstream
RIE1 1300
Direct plasma 660
RIE2 1500
Downstream
130
3
4
600
80
10
600
1
2
Ashing Rates for Photomask SC1827 Resist
Plasma type
500
40
0
278
Process
RF Power
(Watts)
O2 Flow
(%)
Pressure
(mTorr)
Etch Rate
(Ǻ/Min)
Ar Flow
(%)