2016-2023 Microchip Technology Inc. DS50002489G-page 19
RN4870/71
4.3 RN4871 Module
Figure 4-7 shows the physical dimensions of the RN4871
module. Figure 4-8 illustrates the recommended PCB
layout and Figure 4-9 shows the recommended
mounting details.
Ensure that there is no top copper layer near the test
pin area, indicated by the shaded keep out areas, as
shown in Figure 4-8. When laying out the host PCB, the
areas under the antenna must not contain any top,
inner layer or bottom copper, as shown in Figure 4-9. A
low-impedance ground plane ensures the best radio
performance (best range, lowest noise). Figure 4-9
also shows a space area around the antenna section
for best antenna performance. The ground plane can
be extended beyond the minimum recommended as
required for host PCB EMC noise reduction. For best
range performance, keep all external metal at least
30 mm away from the ceramic chip antenna.
FIGURE 4-7: RN4871 MODULE DIMENSIONS
1.5
1
2.7
5.1
7.5
6.3
9.0
2.1
0.6
0.0
9.0
7.5
16
6.3
5.1
1.0
3.9
1.5
0.0
0.0
4.11
0.58
8.31
6.93
5.25
5.33
5.79
0.63
0.0
0.0
3.1
1.9
4.3
6.7
3.9
16
0.70
0.00
7.18
11.14
0.7
0.0
3.1
1.9
4.3
6.7
0.5
2.7
TP-5
TP-2
TP-3
1.2
2.38
4.85
6.01
0.7
TP-5
TP-2
TP-3
4.75
6.7
7.5
5.5
11.5
9.54
7.5
5.5
11.5
TP-4
3.68
6.0
0.0
TP-4
Shield
mounting
hole
Shield
mounting hole
Pad Positions
Test Point Positions
Bottom View
Pad Detail
TP-1TP-1
Shield
mounting hole
Dimensions are in millimeters
Tolerances:
PCB 7KLFNQHVV: +/-0.06mm
Top View Side View
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