4. Specifications
The reflow oven MISTRAL 360 is developed for lead free reflow soldering of SMT boards,
hybrid boards or curing adhesives.
Transport system
The boards are transported through the oven on a conveyor belt made from high grade
stainless steel mesh conveyor belt with variable speed between 15 and 110 cm/min (6 to 43.31
inch/min).
Heating system
Heating is achieved by forced air convection. This reduces the shadow effects and results in
no colour sensitivity, no hot spots and no cold solder joints. The heating system is suitable for
lead-free soldering.
Cooling system
Bottom cooling fans at the offload section ensure cooling of your circuits before leaving the
transport belt.
Control
All functions are controlled by a TFT touch screen display which is easy to program with a
user friendly interface.
Furthermore this control is equipped with a USB 2.0 master port for data output to storage device.
The is a second USB 2.0 (slave) and the Ethernet port are for future communication with external
devices. E.g. a PC.
Exhaust
The integrated exhaust system transports fumes to an outdoor ventilation or filtration unit.
Thermocouple wire
The included thermocouple wire can be used to monitor the temperature progress when
attached to a PCB or any other object running through the oven on the conveyor belt.
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