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7.5 SMT Profile
Thin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow soldering
process to avoid poor solder joint caused by PCB bending.
Figure 7-3 SMT furnace temperature curve
Technical parameters:
Ramp up rate: 1 to 4 °C/sec
Ramp down rate: -3 to -1 °C/sec
Soaking zone: 150-180 °C, Time: 60-100 s
Reflow zone: >220 °C, Time: 40-90 s
Peak temperature: 235-250 °C
Neoway will not provide warranty for heat-responsive element abnormalities caused by improper
temperature control.
For information about cautions in N21 storage and mounting, refer to Neoway Module Reflow
Manufacturing Recommendations.
When manually desoldering the module, use heat guns with great opening, adjust the temperature to
250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is
melt. Then remove the module using tweezers. Do not shake the module in high temperatures while
removing it. Otherwise, the components inside the module might get misplaced.
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