System Operations Manual
www.paceworldwide.com
Page 6 of 50
Figure 1b
A. Reflow Head Contains the top-side heater and moves up and down
via an electric motor that is controlled through the
software. The reflow head is clutched to control
downward force. through the reflow head.
B. Sensor Inputs Contains the camera and beam splitter (prism). The
housing extends and retracts automatically during
operation and the lights for the optics will turn on/off
automatically when the housing is extended/retracted.
C. Cooling Fan The component and PCB are cooled by the cooling fan,
and can be activated automatically after the reflow cycle
is complete or operated manually.
D. Board Holder Fine adjustment of both the X and Y direction is
achieved by using the adjusting knobs on the end of the
holder for X and on the front of the machine for Y.
The right side of the holder is spring loaded to hold the
PCB securely.
E. Emergency Off Switch In case an emergency shut down is necessary, press
this button.
.
F. Sensor Inputs The sensor inputs are K-type thermo-couples.
Measured temperatures are displayed through the PC
software in real time for use in making profile graphs.
G. Bottom Side Heater Used to warm the PCB from the underside. It is an IR
type heating source.
H. On / Off Switch Used to turn the system on or off. When turning off the
system, always turn off the PC using the windows
interface first. When starting the system, always turn on
TF1700 before starting the PC software.
2. Safety Information
a. Do not contact the Heater or its peripheral parts during operation.
b. Once turned off, let the unit cool completely before contacting. They are hot, you
will get burned.
c. When using fluxes, use fume extraction equipment or use in a well-ventilated
area to minimize operator exposure to fumes.
d. Do not use near combustible vapors.
e. Do not leave the equipment unattended when in use.
f. Do not open rear panel without disconnecting the main power cable.
3. Features
a. The TF 1700 and TF 2700 are ideal for post assembly rework, repair, and low
volume/short run production operations. The TF 1700 and TF 2700 can remove
and install PBGAs, CSPs, FCs, LGAs, LCC’s and other SMDs.
b. Featuring unparalleled thermal performance, PACE BGA Rework Stations
flexibility and state of the art process software means no other system is easier
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