Panasonic HC-VX870PP - Baking of replacement IC and defective P.C.B.

 b) HC-WX970PP, VX870PP, V770PP
 c) HC-WX970EB/EF/EG/EP, WX979EG, VX870EB/EF/EG/EP, VX878EG, V770EB/EC/EF/EG/EP, V777EG
 d) HC-WX970EE, VX870EE, V770EE
 e) HC-V760EE
 f) HC-WX970GK, WX970MGK, VX870GK, VX870MGK, V770GK, V770MGK
 g) HC-WX970MGN, VX870MGN, V770MGN
 h) HC-WX970PU/GC/GW, WX970MGH, VX870PU/GC/GW, VX870MGH, V770GC/GW
What is the difference is that the “INITIAL SETTING” data which is stored in Flash ROM mounted on Main P.C.B..
3.3.1 Defining methods:
To define the model suffix to be serviced, refer to the rating label and caution label which are putted on the Unit.
NOTE:
After replacing the MAIN P.C.B., be sure to achieve adjustment.
3.4 Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the
P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
Page 2 of 3
1/3/2018
file://C:\Users\sh.dehghani\AppData\Local\Temp\Rar$EXa0.510\viewing\SGML_VIEW_D
...