KX-TCD400RUÐ’ / KX-TCD400RUC / KX-TCD400RUF / KX-A140RUB / KX-A140RUC / KX-A140RUF
25.1. IC1 (BBIC)...............................................................................57
26 EEPROM LAYOUT (BASE UNIT).............................................59
26.1. Scope.......................................................................................59
26.2. Introduction............................................................................. 59
26.3. EEPROM Layout....................................................................59
27 EEPROM LAYOUT (HANDSET)
...............................................61
27.1. Scope.......................................................................................61
27.2. Introduction..............................................................................61
27.3. EEPROM contents................................................................. 61
28 HOW TO REPLACE FLAT PACKAGE IC
................................
64
28.1. Preparation
............................................................................. 64
28.2. Procedure................................................................................64
28.3. Modification Procedure of Bridge
........................................
64
29 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
................................................................................................65
30 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 66
31 ACCESSORIES AND PACKING MATERIALS..........................67
32 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
68
32.1. Base Unit
................................................................................. 68
32.2. Handset....................................................................................68
33 REPLACEMENT PARTS LIST..................................................69
33.1. Base Unit................................................................................. 69
33.2. Handset....................................................................................70
33.3. Accessories and Packing Materials......................................71
33.4. Fixtures and Tools...................................................................71
33.5. Memo........................................................................................72
34 SCHEMATIC DIAGRAM (BASE UNIT)......................................73
35 SCHEMATIC DIAGRAM (HANDSET)........................................75
36 CIRCUIT BOARD (BASE UNIT)................................................77
36.1. Component View.....................................................................77
36.2. Flow Solder Side View...........................................................78
37 CIRCUIT BOARD (HANDSET)..................................................79
37.1. Component View.....................................................................79
37.2. Flow Solder Side View...........................................................80
3