Quectel BC65 - Page 7

NB-IoT Module Series
BC65 Hardware Design
BC65_Hardware_Design 6 / 55
4.1.2. Antenna Reference Design ............................................................................................ 36
4.1.3. Antenna Requirements .................................................................................................. 36
4.2. Reference Design of RF Layout ............................................................................................... 37
4.3. Recommended RF Connector for Antenna Installation ............................................................ 39
5 Reliability, Radio and Electrical Characteristics ............................................................................ 41
5.1. Operating and Storage Temperatures ...................................................................................... 41
5.2. Current Consumption ................................................................................................................ 42
5.3. RF Output Power ...................................................................................................................... 43
5.4. RF Receiving Sensitivity ........................................................................................................... 43
5.5. Electrostatic Discharge ............................................................................................................. 44
6 Mechanical Dimensions .................................................................................................................... 45
6.1. Mechanical Dimensions of the Module ..................................................................................... 45
6.2. Recommended Footprint .......................................................................................................... 47
6.3. Top and Bottom Views of the Module ....................................................................................... 48
7 Storage, Manufacturing and Packaging .......................................................................................... 49
7.1. Storage ...................................................................................................................................... 49
7.2. Manufacturing and Soldering .................................................................................................... 50
7.3. Packaging ................................................................................................................................. 51
7.3.1. Tape and Reel Packaging .............................................................................................. 51
8 Appendix Reference .......................................................................................................................... 53