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Quectel BG95 - User Manual

Quectel BG95
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BG95&BG96
Compatible Design
LPWA Module Series
Rev. BG95&BG96_Compatible_Design_V1.0
Date: 2019-12-13
Status: Released
www.quectel.com
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Quectel BG95 Specifications

General IconGeneral
ChipsetQualcomm MDM9205
LTE CategoryCat M1/Cat NB2
GNSSGPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature-40°C to +85°C
Storage Temperature-45°C to +90°C
SIM Interface1.8V/3V
Dimensions23.6 mm × 19.9 mm × 2.2 mm
LTE Cat NB2 Data Rate127kbps (DL), 158kbps (UL)
EGPRS Data Rate296kbps (DL), 236.8kbps (UL)
Supply Voltage Range3.3V to 4.3V
Power ConsumptionPSM: 3.2 μA
InterfacesUART, USB 2.0, I2C, SPI, GPIO, ADC
SMSText and PDU Mode
ProtocolsTCP/UDP/PPP
CertificationsFCC, IC, CE, RCM, PTCRB, GCF
Frequency BandsGSM: 850/900/1800/1900MHz

Summary

About the Document

Revision History

Details the revision history of the document, including date and author.

1 Introduction

2 General Descriptions

2.1. Product Description

Provides a detailed description of BG95 and BG96 modules and their compatibility.

3 Pin Definition

3.1. Pin Assignment

Shows the pin assignment diagram for both BG95 and BG96 modules.

4 Hardware Reference Designs

4.1. Power Supply

Details the reference design for power supply for BG95 and BG96 modules.

4.2. Turn-on

4.3. Turn-off

4.3.1. Turn off Module via AT Command (BG95;BG96)

Describes how to turn off the module using AT+QPOWD command.

4.3.2. Turn off Module by PWRKEY and VBAT (BG95;BG96)

Explains the procedure for turning off the module using PWRKEY and VBAT.

4.4. Reset

4.5. Network Status Indication

4.6. Operation Status Indication

4.7. (U)SIM Interface

4.8. UART Interfaces

4.9. USB Interface

4.10. PCM and I2 C Interfaces

4.11. ADC Interfaces

4.12. GPIO Interfaces*

4.13. GRFC Interfaces*

4.14. RF Antenna Interfaces

5 Recommended Footprint and Stencil Design

5.1. Recommended Compatible Footprint

Presents the recommended footprint design for BG95 and BG96 modules.

5.2. Recommended Stencil Design

5.3. Installation Sketch Map

6 Manufacturing and Packaging

6.1. Manufacturing and Soldering

Details the recommended reflow soldering thermal profile and parameters.

6.2. Packaging

7 Appendix A References

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