Quectel EG06 Series User Manual

LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 81 / 89
Heatsink
EG06 Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG06 Module
Shielding Cover
Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. Make sure that customers’ PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. In order to protect the components from damage, the thermal design should be maximally optimized
to make sure the module’s internal temperature always maintains below 105°C . Customers can
execute AT+QTEMP command to get the module’s internal temperature.
NOTES

Quectel EG06 Series Specifications

General

Brand	Quectel
Model	EG06 Series
Category	Control Unit
Language	English