1. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the
modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC
J-STD-033 or the relative moisture is over 60 %, it is recommended to start the solder reflow
process within 24 hours after the package is removed. And do not remove the packages of
tremendous modules if they are not ready for soldering.
2. Take the module out of the packaging and put it on high-temperature resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
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