Quectel EG915U Series - Recommended Footprint

LTE Standard Module Series
EG915U_Series_Hardware_Design 78 / 91
7.3 Recommended Footprint
Figure 38: Recommended Footprint (TOP View)
.
1. For easy maintenance of the module, keep about 3 mm between the module and other components
on the motherboard.
2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least
1.2 mm
NOTE