Quectel L76 Hardware Design

GNSS Module Series
L76&L76-L_Hardware_Design 53 / 59
Temp. (°C)
Reflow Zone
Soak Zone
246
200
217
235
C
D
B
A
150
100
Max slope: 1~3 °C/s
Cooling down slope:
-1.5 ~ -3 °C/s
Max slope:
2~3 °C/s
Figure 29: Recommended Reflow Soldering Thermal Profile
Table 10: Recommended Thermal Profile Parameters
Factor
Recommendation
Soak Zone
Max. slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max. slope
2–3 °C/s
Reflow time (D: over 217 °C)
40–70 s
Max. temperature
235 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max. reflow cycle
1

Quectel L76 Specifications

General

Brand	Quectel
Model	L76
Category	Motherboard
Language	English