Operation beyond the "Recommended Operating Conditions" is not recommended and extended
exposure beyond the "Operating Conditions" may affect device reliability.
6.3. ESD Protection
All the three modules are ESD sensitive devices. Therefore, proper ESD handling and packaging
procedures must be applied throughout the processing, handling and operation of any application that
incorporates the modules.
The following measures ensure ESD protection when the modules are handled:
⚫ When mounting the modules onto a motherboard, make sure to connect the GND first, and then the
RF_IN pad.
⚫ When handling the RF_IN pad, do not come into contact with any charged capacitors or materials
that may easily generate or store charges (such as patch antenna, coaxial cable, soldering iron, etc.).
⚫ When soldering the RF_IN pin, make sure to use an ESD safe soldering iron (tip).
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