Quectel LTE OPEN EVB - Key Features

LTE Module Series
LTE OPEN EVB User Guide
LTE_OPEN_EVB_User_Guide 11 / 62
2.2. Key Features
The following table describes the detailed features of LTE OPEN EVB.
Table 1: Key Features of LTE OPEN EVB
Features
Implementation
Power Supply
DC power supply (J0301 or J0601): 4.5V~5.5V, typically 5.0V
VBAT (T0104)
1)
: 3.8V
LTE TE-A Interface
Support Quectel LTE-QuecOpen modules: EC2x/BG96/AG35-QuecOpen
Wi-Fi & Ethernet TE-A
Interface
Support Quectel Wi-Fi modules: FC20/AF20
eMMC Device
Manufacturer: MICRON
Part number: MTFC4GACAJCN-4M IT
SD Card Interface
Support standard SD card and TF card
SPI Flash Device
Manufacturer: GIGADEVICE
Part number: GD25LQ64CWIGR
EEPROM Device
Manufacturer: ATMEL
Part number: AT24CS64-SSHM-T
U(SIM) Interface
Support U(SIM) card insertion detection
Support U(SIM) card: 3.0V and 1.8V
Audio Interfaces
 One digital audio codec board interface
Support Realteck ALC5616 and TI Codec TLV320AIC3104
 Three analog interfaces used for loudspeaker, earphone and
handset
UART Interfaces
Three UART interfaces:
 COM (MAIN):
Serial interface for data communication
Maximum baud rate supported: 1Mbps
2)
 COM (DEBUG):
Serial interface for debugging purpose
Maximum baud rate supported: 1Mbps
2)
 COM (UART1):
Serial interface for data communication
Maximum baud rate supported: 1Mbps
2)
USB Interface
Micro-B interface
Signal Indicators
4 LEDs are available for signal indication
4 LEDs are available for GPIO testing