Quectel LTE Standard Module Series User Manual

LTE Module Series
EG21-G Hardware Design
EG21-G_Hardware_Design 75 / 100
 The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG21-G Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG21-G Module
Shielding Cover
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)

Quectel LTE Standard Module Series Specifications

General

Brand	Quectel
Model	LTE Standard Module Series
Category	Wireless modules
Language	English