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SG368Z-AP
Quectel SG368Z-AP User Manual
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Module
Series
SG368Z_Series_Hardware_Design
100
/
11
3
7.2.
Recommended Footpri
nt
Figure
40
:
Recomm
en
ded Footprint
.
Keep
at
least
3
mm
between
the
module
and
other
components
on
the
motherboard
to
improve
soldering quality and maintenance convenience.
NOTE
100
102
Table of Contents
Safety Information
4
About the Document
5
Contents
6
Table of Contents
6
1 Introduction
12
Special Marks
12
2 Product Overview
13
Frequency Bands and Functions
13
Key Features
14
Functional Diagram
16
Pins Assignment
18
Pins Description
19
EVB Kit
34
3 Operating Characteristics
35
Power Supply
35
Power Supply Interface
35
Reference Design for Power Supply
35
Requirements for Voltage Stability
36
Turn on
37
Turn on with PWRKEY
37
Turn on with PON_1
38
Turn Off/Restart
39
Standby
39
Power Output
39
4 Application Interfaces
41
USB Interfaces
41
Micro USB Interface
42
USB Type-A Interface
44
USB Interface Design Considerations
45
Vol_Up/Boot
46
SD Card Interface
47
Uart
49
I2C Interfaces
50
I2S Interfaces
51
PDM Interface
52
Analog Audio Interfaces
52
Microphone Interface Reference Design
53
Headset Interface Reference Design
54
Loudspeaker Interface Reference Design
55
Audio Interfaces Design Considerations
55
ADC Interfaces
56
Video Output Interfaces
56
Edp Interface
57
HDMI Interface
59
LCM Interfaces
62
Camera Interface
64
MIPI Design Considerations
68
Touch Panel Interface
70
Pcie Interfaces
70
RGMII Interfaces
75
Gpio
81
5 RF Specifications
84
Wi-Fi & Bluetooth
84
Wi-Fi Overview
84
Bluetooth Overview
87
Reference Design
88
RF Routing Guidelines
88
Requirements for Antenna Design
90
RF Connector Recommendation
91
6 Electrical Characteristics and Reliability
93
Absolute Maximum Ratings
93
Power Supply Ratings
93
Power Consumption
94
Digital I/O Characteristics
95
ESD Protection
97
Operating and Storage Temperatures
98
7 Mechanical Information
99
Mechanical Dimensions
99
Recommended Footprint
101
Top and Bottom Views
102
8 Storage, Manufacturing & Packaging
103
Storage Conditions
103
Manufacturing and Soldering
104
Packaging Specification
106
Carrier Tape
106
Plastic Reel
107
Mounting Direction
107
Packaging Process
108
9 Appendix References
109
4
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Quectel SG368Z-AP Specifications
General
Brand
Quectel
Model
SG368Z-AP
Category
Control Unit
Language
English
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