Reyee RG-E6 - ESD Protection Requirements; Anti-Interference

Hardware Installation and Reference Guide Preparing for Installation
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but also increases the likelihood of communication failures. The risk of electrostatic adsorption increases when
the indoor relative humidity is low.
The following table describes the requirements for the dust content and granularity.
Max. Diameter (μm)
0.5
1
3
5
Max. Concentration
(Number Of
Particles/m
3
)
1.4×107
7×105
2.4×105
1.3×105
In addition to dust, the device also has specific requirements regarding the presence of harmful gases such as
hydrochloric acid sulfides in the air at the installation site. These gases can cause accelerated corrosion of
metals and aging of certain components. The following table describes the specific limits for harmful gases
including SO
2
, H
2
S, NO
2
, NH
3
, and Cl
2
in the installation site.
Gas
Avg. (mg/m
3
)
Max. (mg/m
3
)
Sulfur dioxide (SO
2
)
0.2
1.5
Hydrogen sulfide (H
2
S)
0.006
0.03
Nitrogen dioxide (NO
2
)
0.04
0.15
Ammonia gas (NH
3
)
0.05
0.15
Chlorine gas (CI
2
)
0.01
0.3
2.2.3 ESD Protection Requirements
This device is designed with rigorous anti-static procedures during circuit design. However, excessive static
electricity can still cause damage to its circuit board. Static electricity in the communication network connected
to the device mainly originates from two sources:
 Outdoor high-voltage transmission lines, lightning and other external electric fields; and
 Internal systems such as indoor flooring materials and overall structure of the device.
To prevent damage caused by static electricity, pay attention to the following:
 Keep the indoor installation environment clean and free of dust.
 Maintain appropriate temperature and humidity.
2.2.4 Anti-interference
Anti-interference measures primarily target electromagnetic and current interferences. The following
requirements should be met to ensure effective mitigation of interference:
 Take effective measures to prevent interference from power grid to the power supply system.
 Keep the device away from the grounding facility or lightning and grounding facility of the power device as
much as possible.
 Keep the device far away from high-frequency current devices such as high-power radio transmitting stations
and radar launchers.