Sage II - Temperature Test; Operation Guidelines

SAGE
rr
sERVrcE
MANUAL
[1.0J
TEI'{PEMTURE
TEST
IX
TEI{PERATURE
TEST
:
Ideally,
a
servlce
center
wj.ll
have
a
temperature
chamber
in
whlch
to
place
the
system
and
vary
the
temperature
up and
down
to
determlne
if
the
unlt ts
truly
sensitlve
to
temperature
variations.
As thls
nethod
ls
very
expensive
and
somewhaL
time-consurnl-ng,
this
test
outllnes
some
general
guldellnes
for
checking for
a
temperature problem.
The
technlcian
needs
only
a heat
gun
and
cans of
ttfreeze"
spray,
The
test
ls
somewhat
of an
art
as
the technlcian
has
little
ldea
of the
true
measure
of the
temperature
being applied
to
the
board.
Beglnners
tend
to fry
or frost-bLte
chips
doing
more damage
than
good.
Remember
that
the
customer
who
cornplained
of the
problem
is probably
not
tryi.ng
to
program
ln
adverse
weather
conditions.
Slight
varlations
from
th;
normal
room
temperature
of
your
service
eenter
should
be enough
to
identlfy
the
problem
as
tttemperature
senslt.ivett
or not.
Remember
that
al-l
systems
have
some hot
or
cold llnlt
where
thev
will
nornally qult
operatlng.
OPERATIOH:
l.
2.
3.
Remove
the
lid from
the
system.
If the
system
wl11
boot
fairly
start
the
test.
Otherwi.se,
set
over
and
over
(See
the
writeup
varying
the
temperature.
conslstently,
boot
to
CyCLER and
the
switches
on the
back
to reboot
on
the
POWER-UP
routlne
)
whlle
HEAT:
Visually
dlvtde
the
board lnto
sectLons.
Apply
heat
wlth
a
heat gun
evenly
over the
sectlon.
The
chips should
be
hot
enough
to
cause
dlsconafort
if
touched
but
not
enough
to
burn
the
skin,
Let the
board
cool
down
between
lntervals
so that
expanslon
and
contractlon
occurs
within
the
chips
and
socket
connectlons.
Do
aLl-
sections
of the
board"
If
a
problen
occurs
try
to narrow
the
cause
down
to
a
single
chip
(or
socket
or connector).
4.
cootr,:
A
can
of
ttf
reezett
spray
can
be
used
to
check
f
or
temperature
sensLtlvity
ln
the
cold
range.
Again
use
cautlon.
Hotr-ding
the
nozzLe
on
a
chip
w111
usually
make the
system
fall
ancl
may
permanentLy
danage
the
chlp,
Use short
bursts
over
sectlons
of
the
board.
let
the
board
warm
up
between
bursts
so that
expansion
and
contraction
occurs
within
the
chlps
and
socket
connectlons.
Loose
cables
or
bad
sockets
may
masquerade
as a
temperature
problem.
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