Siemens TC65 - Board-To-Board Application Connector; Table 23: Technical Specifications of Molex Board-To-Board Connector

TC65 Hardware Interface Description
Strictly confidential / Draft
s
TC65_HD_V00.521 Page 85 of 99 24.05.2005
6.3 Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to
connect TC65 to the external application.
Connector mounted on the TC65 module:
Type: 52991-0808 SlimStack Receptacle
80 pins, 0.50mm pitch,
for stacking heights from 3.0 to 4.0mm,
see Figure 36 for details.
Supplier: Molex
www.molex.com
Table 23: Technical specifications of Molex board-to-board connector
Parameter Specification (80-pin B2B connector)
Electrical
Number of Contacts 80
Contact spacing 0.5mm (.020")
Voltage 50V
Rated current 0.5A max per contact
Contact resistance 50m max per contact
Insulation resistance > 100M
Dielectric Withstanding Voltage 500V AC (for 1 minute)
Physical
Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0
Contact material Plating: Gold over nickel
Insertion force 1
st
< 74.4N
Insertion force 30
th
< 65.6N
Withdrawal force 1
st
> 10.8N
Maximum connection cycles 30 (@ 70m max per contact)
Mating connector types for the customer's application
offered by Molex:
• 53748-0808 SlimStack Plug, 3mm stacking height,
see Figure 37 for details.
• 53916-0808 SlimStack Plug, 4mm stacking height