3131
CDP-CX355
• Waveform
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. p : pF. 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
• C : panel designation.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
No mark : STOP
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD
c : digital
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
a
: Through hole.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in
each block.)
Note:
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
CEB
These are omitted.
5.9Vp-p
1.3Vp-p
1 IC101 yj XTAO
1V/DIV, 20ns/DIV
500mV/DIV, 1µs/DIV
200mV/DIV, 20ms/DIV
200mV/DIV, 4ms/DIV
1V/DIV, 4µs/DIV
1V/DIV, 40ns/DIV
2 IC101 ta (RFAC)
3 IC101 ra TE
4 IC101 el FE
2.4 Vp-p
5 IC101 wh MDP
5.9 Vp-p
6 IC501 qs X'TAL OSC1
59ns
7.5
µ
s
100ns
(PLAY)
2.5V
APPROX 500mVp-p (PLAY)
2.5V
APPROX 200m Vp-p (PLAY)
• Circuit Board Location
SECTION 7
DIAGRAMS
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