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Sony CDX-51 - Notes on Handling the Optical Pick-Up Block or Base Unit; Servicing Note

Sony CDX-51
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NOTES
ON
HANDLING
THE
OPTICAL
PICK-UP
BLOCK
OR
BASE
UNIT
The
laser
diode
in
the
optical
pick-up
block
may
suffer
electrostatic
breakdown
because
of
the
potential
difference
generated
by
the
charged
electrostatic
load,
etc.
on
clothing
and
the
human
body.
During
repair,
pay
attention
to
electrostatic
breakdown
and
also
use
the
procedure
in
the
printed
matter
which
is
included
in
the
repair
parts.
The
flexible
board
is
easily
damaged
and
should
be
handled
with
care.
Laser
Diode
Properties
@
=
Material:
GaAlAs
©
Wavelength:
780
nm
@
Emission
Duration:
continuous
@
Laser
Output
Power:
less
than
44.6
4
W*
*
This
output
is
the
value
measured
at
a
distance
of
200
mm
from
the
objective
lens
surfase
on
the
Optical
Pick-up
Block.
CAUTION
Use
of
controls
or
adjustments
or
performance
of
procedures
other
than
those
specified
herein
may
result
in
hazardous
radistion
exposure.
SAFETY-RELATED
COMPONENT
WARNING!!
COMPONENTS
IDENTIFIED
BY
MARK
f\
OR
DOTTED
LINE
WITH
MARK
§\
ON
THE
SCHEMATIC
DIAGRAMS
AND
IN
THE
PARTS
LIST
ARE
CRITICAL
TO
SAFE
OPERATION.
REPLACE
THESE
COMPONENTS
WITH
SONY
PARTS
WHOSE
PART
NUMBERS
APPEAR
AS
SHOWN
IN
THIS
MANUAL
OR
IN
SUPPLEMENTS
PUB-
LISHED
BY
SONY.
ATTENTION
AU
COMPOSANT
AYANT
RAPPORT
A
LA
SECURITE!
LES
COMPOSANTS
IDENTIFIES
PAR
UNE
MARQUE
{\
SUR
LES
DIAGRAMMES
SCHEMATIQUES
ET LA
LISTE
DES
PIECES
SONT
CRITIQUES
POUR
LA
SECURITE
DE
FONCTIONNEMENT.
NE
REMPLACER
CES
COM-
POSANTS
QUE
PAR DES
PIECES
SONY DONT
LES
NUMEROS
SONT
DONNES
DANS
CE
MANUEL
OU
DANS
LES
SUPPLEMENTS
PUBLIES
PAR
SONY.
TABLE
OF
CONTENTS
Section
Title
Page
1
Specifications
Notes
on
Handling
the
Optical
Pick-up
Block
or
Base
Unit
2
Servicing
Note
<++++++eeeeecteeeeeee
eter
eee
eees
2
1.
GENERAL
Installation
3
Connections
s
Location
and
Function
of
Controls
-++++++++++
6
2
DISASSEMBLY
«-.-.----------e
cece
eee
ee
7
3.
MECHANICAL
ADJUSTMENTS
3-1.
Elevator
Height
Adjustment
++
++++++++++++*
10
4.
ELECTRICAL
ADJUSTMENTS
4-1.
Focus
Offset
Adjustment
--
4-2.
Tracking
Offset
Adjustment
-
4-3.
DC
Balance
Adjustment
5.
DIAGRAMS
5-1.
Compact
Disc
Changer
Section
Block
Diagram
5-2.
Hideaway
Section
Block
Diagram
5-3.
Compact
Disc
Changer
Section
Printed
Wiring
Boards
«+++
++++++eeeeeeeees
20
5-4.
Compact
Disc
Changer
Section
Schematic
Diagram
5-5.
Hideaway
Section
Printed
Wiring
Board
-
5-6.
Hideaway
Section
Schematic
Diagram
5-7.
IC
Pin
Function
Description
6.
EXPLODED
VIEWS
«--------).--s-0e0
38
7.
ELECTRICAL
PARTS
LIST
------------
45
SUPPLEMENT-1
SERVICING
NOTE
Flexible
Circuit
Board
Repairing
Keep
the
temperature
of
the
soldering
iron
around
270°C
during
repairing.
Do
not
touch
the
soldering
iron
on
the
same
conductor
of
the
circuit
board
(within
3
times).
Be
careful
not
to
apply
force
on
the
conductor
when
soldering
or
unsoldering.
Notes
on
chip
component
replacement
aay
as
Never
reuse
a
disconnected
chip
component.
Notice
that
the
minus
side
of
a
tantalum
capacitor
may
be
damaged
by
heat.

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