Sony HCD-C70 - Page 31

HCD-C70/C90
6-9. PRINTED WIRING BOARD
* PANEL SECTION
« See page 23 for Circuit Boards Location and see page 53, 54 for Semiconductor Lead Layouts.
| 2 3 4 5 6 | 7 8 9 lo | i l2. | 13
(See Page 40) . | (See Page 35)
(PANEL BOARD] ll TUEH POARD
* Semiconductor Location
Location
eo
Sho esterase
TEREO
/MONO
Note:
* o-—— : parts extracted from the components side.
° A : internal component.
* [__]: panel designation
* @ : Through hole.
* dd 1 Pattern on the side which is seen.
CND : Canadian model e visu 2 Pattern of the rear side.
G ~ : German model
IT — : Italian model
EA: Saudi Arabia model
: : : : : 3 AUS : Australian model
J
meet
R
‘T
S
1EMC
“——
CHARACTER
:
SP:
Singapore
model
:
Se
inoue
Sen!
1~649-224-—
JE:
Tourist
model