Sony HCD-EC599 - SERVICING NOTES; Handling Optical Pick-up Block or Base Unit

HCD-EC599
2
1. SERVICING NOTES ............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 6
2-2. Side Panel (L)/(R) ........................................................... 6
2-3. Top Panel Assy ................................................................ 7
2-4. Front Panel Block ........................................................... 7
2-5. Knob (VOLUME) ........................................................... 8
2-6. POWER Board ................................................................ 8
2-7. Base Unit (BU-D1BD76) ................................................ 9
2-8. Optical Pick-up Block (DA11MMVGP) ........................ 9
3. TEST MODE ............................................................ 10
4. ELECTRICAL CHECKS ...................................... 12
5. DIAGRAMS
5-1. Block Diagram - CD/USB Section - ............................... 13
5-2. Block Diagram - MAIN Section - ................................... 14
5-3. Block Diagram - DISPLAY/POWER Section - .............. 15
5-4. Printed Wiring Board - BD76 Board - ............................ 17
5-5. Schematic Diagram - BD76 Board (1/2) - ...................... 18
5-6. Schematic Diagram - BD76 Board (2/2) - ...................... 19
5-7. Printed Wiring Boards - PANEL Board - ........................ 20
5-8. Schematic Diagram - PANEL Board (1/2) - ................... 21
5-9. Schematic Diagram - PANEL Board (2/2) - ................... 22
5-10. Printed Wiring Boards
- POWER and TRANS Boards - ..................................... 23
5-11. Schematic Diagram - POWER Board - .......................... 24
5-12. Schematic Diagram - TRANS Board - ........................... 25
5-13. Printed Wiring Board - TUNER1 Board - ...................... 26
5-14. Schematic Diagram - TUNER1 Board - ......................... 26
6. EXPLODED VIEWS
6-1. Overall Section ............................................................... 34
6-2. Front Panel Section ......................................................... 35
6-3. Chassis Section ............................................................... 36
6-4. Top Panel Section ........................................................... 37
7. ELECTRICAL PARTS LIST .............................. 38
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.