Sony HDCU2000 - Product Specifications; HDCU2000 General Specifications; HDCU2000 Input;Output Connectors

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Specifications
Specifications
HDCU2000
General
Power supply 100/120/220-240 V AC, 50/60 Hz
(To change to a different power supply,
contact a Sony service or sales
representative.)
Current consumption 5.4 A (max.)
Operating temperature +5°C to +40°C (+41°F to 104°F)
Storage temperature –20°C to +60°C (–4°F to 140°F)
Mass Approx. 17.5 kg (38 lb 9 oz)
Dimensions (Unit: mm (inches))
Input/Output connectors
CAMERA Optical fiber connector (1)
240 V AC power supply
INTERCOM/TALLY/
PGM
D-sub 25-pin connector (1)
• INTERCOM (PROD/ENG), 4W/RTS/CC,
0 dBu
• PGM, 2 systems, 0 dBu/–20 dBu
• TALLY (R, G, Y)
•FLAG
RCP/CNU 8-pin multi-connector (1)
AUX REMOTE 8-pin multi-connector (1)
TRUNK A 12-pin (1)
TRUNK LINE D-sub 9-pin, female (1), RS-232C, for CHU
transmission or system expansion
I/O PORT D-sub 15-pin, female (1)
(JAE-made DA-C1-J10 recommended)
424 (16
3
/
4
)
410.0 (16
1
/
4
)
52.7 (2
1
/
8
)
465 (18
3
/
8
)
481 (19)
133 (5
1
/
4
)
LAN 8-pin (1)
NETWORK TRUNK 8-pin (1)
Input connectors
AC IN (1), 100/120/220-240 V
(To change to a different power supply,
contact a Sony service or sales
representative.)
SDI RET IN BNC-type (4)
3G-SDI: SMPTE 424M/425M, 2.970 Gbps/
2.967 Gbps
HD-SDI: SMPTE 292M, 1.485 Gbps/
1.4835 Gbps
SD-SDI: SMPTE 259M, 270 Mbps
VBS RET IN BNC-type (4), analog signal, 1.0 V p-p,
75 ohms
REFERENCE BNC-type (2), loop-through output
HD: SMPTE 274M, tri-level sync, 0.6 Vp-p,
75 ohms
SD: Black burst (NTSC: 0.286 Vp-p,
75 ohms/PAL: 0.3 Vp-p, 75 ohms) or NTSC
10F-BB
PROMPTER 1, 2 BNC-type (4), loop-through output, analog
signal, 1.0 Vp-p, 75 ohms
MIC REMOTE D-sub 15-pin (1) (JAE-made DA-C1-J10
recommended)
HD PROMPTER IN BNC-type (1), SMPTE 292M, 75 ohms,
1.485 Gbps/1.4835 Gbps
Output connectors
AUDIO OUT CH1,
CH2
XLR 3-pin, male (2), 0 dBu/–20 dBu/+4 dBu
AES/EBU BNC-type (1), AES/EBU format
CHARACTER BNC-type (1), VBS, 1 Vp-p, 75 ohms,
character on/off switchable
WF REMOTE D-sub 15-pin, female (1) (JAE-made DA-
C1-J10 recommended)
3G/HD SDI OUTPUT BNC-type (2)
3G-SDI: SMPTE 424M/425M, 0.8 Vp-p,
75 ohms, 2.970 Gbps/2.967Gbps
HD-SDI: SMPTE 292M, 0.8 Vp-p, 75 ohms,
1.485 Gbps/1.4835 Gbps
3D-SDI/HD-SDI selectable.
3G/HD SDI OUTPUT
(MONI)
BNC-type (2)
3G-SDI: SMPTE 424M/425M, 0.8 Vp-p,
75 ohms, 2.970 Gbps/2.967Gbps
HD-SDI: SMPTE 292M, 0.8 Vp-p, 75 ohms,
1.485 Gbps/1.4835 Gbps
3G-SDI/HD-SDI and character ON/OFF
selectable
HD/SD SDI OUTPUT BNC-type (2)
HD-SDI: SMPTE 292M, 0.8 Vp-p, 75 ohms,
1.485 Gbps/1.4835 Gbps
SD-SDI: SMPTE 259M, 0.8 Vp-p, 75 ohms,
270 Mbps
HD-SDI/SD-SDI selectable.