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Appendix B: System Specications
Appendix B
System Specications
Processors
Supports dual 4th Generation Intel® Xeon® Scalable processors (Socket E LGA 4189) with four UPIs (16GT/s max.) and a
thermal design power (TDP) of up to 350W.
Supports SP XCC, SP MCC, and HBM SKU on the X13DEG-OA.
Chipset
Intel C741 PCH
BIOS
AMI 256Mb SPI Flash EEPROM
Memory
32 DIMM slots for up to 8TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800MT/s (1PDC) or
4400MT/s (2DPC)
PCI Expansion Slots
13 PCIe 5.0 X16
One Supermicro AIOM / OCP 3.0
Two M.2 NVMe/SATA3
Storage Drives
24 hot-swap 2.5" Gen5 NVMe/SAS3/SATA3 drive bays
Input/Output
Two 10GbE LAN ports
One RJ45 dedicated BMC LAN port
Two USB 3.0 ports / one VGA port
Motherboard
X13DEG-OA: 17.0 x 15" (431.8 x 381 mm)
Chassis
CSE-418GT2S; 4U Rackmount, 17.2 x 7 x 29in. / 437 x 178 x 737mm (WxHxD)
System Cooling
Eight 9-cm heavy duty fans
Power Supply
Model: PWS-2K70A-1R, Titanium Level Power Supply (80 Plus)
AC Input Voltages: 200-240 VAC auto-range
Rated Input Current: 16.0-13.5A
Rated Input Frequency: 50-60 Hz
Rated Output Power: 2700W: 220 – 240Vac
Rated Output Voltages: 12V+
Max: 225A / Min: 0A (220-240Vac)
12Vsb: Max: 4.0A / Min: 0A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Regulatory Compliance
FCC, ICES, CE, VCCI, RCM, UKCA, NRTL, CB
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