106 Disassembly and Reassembly TB7100 Service Manual
© Tait Electronics Limited October 2005
3. If the thermal paste on the heatsink 1! or the tin-plated cooper plate
of the board has been contaminated, new thermal paste must be
applied:
■ Remove any residue of the old thermal paste from both contact
surfaces.
■ Use Dow Corning 340 silicone heat-sink compound
(IPN 937-00000-55).
Important Ensure that no bristles from the brush come loose and
remain embedded in the paste. The paste needs to be
completely free of contaminants.
■ Use a stiff brush to apply 0.1cm
3
of thermal paste over the
complete contact surface on the tin-plated copper plate (refer to
Figure 7.6 on page 105).
Important With the 50W/40W board, the rectangular gap pad
j
must not overlap the edge of the tin-plated copper plate
(refer to Figure 7.6 on page 105).
4. Place the board in position on the heatsink
1!, and push them
together to spread the thermal paste.
5. Place three screws
g into the holes above the metal heatsink plate by:
a. holding the module at a 60° angle
b. fitting the screw on the Torx driver
c. slipping it through the shield hole and into the PCB hole
6. Use a Torx T10 torque-driver to fasten the three screws
g to 15lbf·in
(1.7N·m).
7. Use a Torx T10 torque-driver to fasten the four screws
f to 4.5lbf·in
(0.5N·m).
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