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TM8100/TM8200 Service Manual Disassembly and Reassembly 139

Fitting the Main-

Board Assembly to

the Chassis

The circled numbers in this section refer to the items in Figure 5.3 on

page 133. This figure shows the 40W/50W configuration.

1. With the 40W/50W radio, the L-shaped gap pad

1) must be replaced

each time the main-board assembly

F is removed from the chassis G:

■ Remove any residue of the old gap pad from the audio-PA area on

the underside of the main board (refer to Figure 5.6 on page 137)

and the L-shaped ridge of the chassis (refer to Figure 5.3 on

page 133).

■ Peel off the transparent film on one side of the gap pad and evenly

press the gap pad on the L-shaped ridge of the chassis.

■ Peel off the transparent film on other of the gap pad.

2. If the thermal paste on the heat-transfer block or the underside of the

main board has been contaminated, new thermal paste must be

applied:

■ Remove any residue of the old thermal paste from both contact

surfaces.

■ Use Dow Corning 340 silicone heat-sink compound

(IPN 937-00000-55).

Important Ensure that no bristles from the brush come loose and

remain embedded in the paste. The paste needs to be

completely free of contaminants.

■ Use a stiff brush to apply 0.1cm

of thermal paste on the heat-

transfer block (refer to Figure 5.3 on page 133).

■ Use a stiff brush to apply 0.01cm

of thermal paste on the

audio-PA heat sink of the chassis (refer to Figure 5.3 on page 133)

3. Place the main-board assembly

F in position in the chassis G.

4. Loosely screw in the two screws

I through the heat-transfer block by

hand.

Tait TM8110 Service Manual

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